PCB Manufacturing Capabilites
PCB layers from 1 to 32L, min trace width/space is 3/3mil
MultPCB Capabilities
Material and size
| Specifications | Standard Technology | Advanced Technology |
| Number of Layers | 1- 12L | 14 – 32L |
| Prototype Quick-turn | 24 hours for bare PCB (1-4 layers) | Please contact us at info@multpcb.com |
| 48 hours for bare PCB (1-6 layers) | ||
| 3 to 7 days (6 to 16 layers) | ||
| PCB board Material | Rigid PCB Materials | |
| FR4 (TG130/TG150/TG170) | ||
| CEM-1, CEM-3 | ||
| High TG FR4 | ||
| Halogen Free material | ||
| Rogers HF material | ||
| Arlon HF material | ||
| Ceramic PCB | ||
| MCPCB board Material | Aluminum Core | |
| Copper Core | ||
| Minimum Board Thickness | 2 layer – 0.015″ (0.4mm) | 2 layer – 0.010″ (0.25mm) |
| 4 layer – 0.020″ (0.5mm) | ||
| 6 layer – 0.020″ (0.5mm) | ||
| 8 layer – 0.062″ (1.6mm) | ||
| 10 layer – 0.062″ (1.6mm) | ||
| 12 layer – 0.062″ (1.6mm) | ||
| Maximum Board Thickness | 1-2 layer – 0.125″ (3.2mm) | |
| 4-12 layer – 0.200″ (5.0mm) | ||
| Board Thickness Tolerance | If more than 1.0mm, ± 10% | |
| If less than 1.0mm, ± 0.10mm | ||
| Maximum Board Size | 1-2 layer – 27.6″ x 23.6″ (700*600mm) | 39.4″ x 23.6″ (1000*600mm) |
| 4-6 layer – 23.6″ x 19.7″ (600*500mm) | 35.4″ x 19.7″ (900*500mm) | |
| 8-16layer – 23.6″ x 18.9″ (600*480mm) | ||
| Minimum Board Size | 10*10mm | 6*6mm |
| Warp and Twist | ≤0.75% | |
| Copper Thickness | 0.5 oz – 3 oz | 4oz – 10 oz |
| Hole Aspect Ratio | 7 : 1 ‘ | 12 : 1 ‘ |
Holes and Slots
| Items | Manufacturing Capabilities | Notes |
| Drill Hole Size(Mechanical) | 0.15-6.5mm (0.3-6.5mm for single-layer PCB) | Minimum drill hole size: 0.15mm(available for PCB thickness ≤ 1.2mm) |
| Drill Hole Size Tolerance | ≤0.05mm | |
| Blind/Buried vias | Mechanical blind buried vias, copper thickness ≥ 20µm | |
| Laser blind buried vias, dimple ≤ 10µm | ||
| Via pad size | ≥0.1mm | |
| Minimum Non-plated Holes | 0.4mm | |
| Minimum Plated Slots | 0.5mm | |
| Minimum Non-plated Slots | 0.5mm | |
| Minimum Castellated Holes | 0.5mm | |
| Hole Size Tolerance(Plated) | ±0.075mm | |
| Hole size Tolerance(Non-Plated) | ±0.05mm | |
| Hole Position Tolerance | ±0.05mm |
Trace and pad rings
| Specifications | Standard Technology | Advanced Technology |
| Min. trace width and spacing (1oz) | 0.10 / 0.10 mm (4 / 4 mil) | 0.075 / 0.075 mm (3 / 3 mil) |
| Min. trace width and spacing (2oz) | 0.16 / 0.16 mm (6.5 / 6.5 mil) | 2-layer: 0.16 / 0.16 mm (6.5 / 6.5 mil) |
| Multilayer: 0.16 / 0.20 mm (6.5 / 8 mil) | ||
| Trace width tolerance | ±20% | For 0.1mm track, the end trace width will be 0.08 to 0.12mm; |
| PTH annular ring | ≧0.20mm | 2-layer: |
| For 1oz, more than 0.25mm, minimum 0.18mm | ||
| For 2oz, 0.254 mm or above | ||
| Multilayer: | ||
| For 1oz, more than 0.20mm, minimum 0.15 mm | ||
| For 2oz, 0.254 mm or above | ||
| NPTH pad annular ring | ≧0.45mm | |
| BGA | 0.25mm | BGA pad diameter ≥ 0.25 mm |
| BGA pad to trace space ≥ 0.1 mm (min. 0.09 mm for multilayer boards) | ||
| Vias can be placed within BGA pads using filled and plated-over vias | ||
| Coils PCB Trace | 0.15/0.15mm | Minimum trace width/clearance is 0.15/0.15mm, while traces are covered by solder mask (1oz). |
| Minimum trace width/clearance is 0.25/0.25mm, while traces are NOT covered by solder mask (1oz). ENIG finish only(high short circuit risk if HASL) | ||
| Hatched grid width and spacing | 0.25 mm | |
| Same-net track spacing | 0.25mm | |
| Inner layer via hole to copper clearance | 0.2mm | |
| Inner layer PTH pad hole to copper clearance | 0.3mm | |
| Pad to track clearance | 0.1mm | Minimum 0.09 mm for BGA pads |
| SMD pad to pad clearance (different nets) | 0.15mm | |
| Via hole to Track | 0.2mm | |
| PTH to Track | 0.28mm | minimum 0.28mm |
| NPTH to Track | 0.2mm |
Soldermask & Silkscreen
| Specifications | Standard Technology | Notes |
| Soldermask Colors | Green, Red, Yellow, Blue, White, Black, Matte Black | |
| Soldermask Opening/expansion | ≥1.5mil (0.04mm) | |
| Soldermask Bridge | Green soldermask, 3.5mil (0.09mm) | To ensure soldermask bridge, pads space must be 3.5mils or more |
| Black/White soldermask, 5mil (0.127mm) | ||
| other soldermask, 4mil (0.10mm) | ||
| Soldermask Thickness | Soldermask thickness on base materia, 0.8mil, soldermask thickness on copper, 0.6mil | |
| Silkscreen Colors | White, Black | |
| Minimum legend width | Silkscreen printing≥5mil (0.127mm) | Hard to identify if the text width < 3mil(0.076mm) |
| Printer printing≥3mil (0.076mm) | ||
| Minimum text height | Silkscreen printing≥30mil (30mil≈0.76mm) | Text height < 24mil(0.61mm) will be unidentifiable |
| Printer printing≥24mil (24mil≈0.61mm) | ||
| Character width to height ratio | ≥ 6:1 | |
| Pad to silkscreen | >6mil (0.15mm) | The minimum distance between pad and text is 0.15mm |
PCB outlines
| Specifications | Standard Technology | Notes |
| Outline type | Routing, or milling | |
| Scoring, or V-cutting | ||
| Beveling | ||
| Punch | ||
| Scouring / V-Cut | V-cut line to pads or trace distance ＞0.4mm | |
| Dimension tolerance for V-cut board edges: ±0.4 mm. PCB thickness ≥ 0.6 mm | ||
| Min. panel dimensions: 70 × 70 mm; max. panel dimensions: 475 × 475 mm | ||
| V-cut groove angle: 20° , 30°, 45°, 60° | ||
| V- Cut Remaining thickness | 1/3 of pcb thickness | |
| V- Cut Remaining thickness Tolerance | ±0.10mm | |
| V-Cut Board Thickness Range | 0.5mm – 3.2mm | |
| V-cut Board Outline Tolerance | ±0.4mm | ±9.8MIL(0.25mm) at most |
| Routing / milling | Milling to pads or trace distance ≧0.2mm | |
| Routing Board Outline Tolerance | ±0.13mm | |
| Minimum Routing width for MCPCB | 1.6mm | |
| Mouse-bites / Stamp holes | 0.2mm | |
| Distance Between the two stamp holes | 0.2mm – 0.3mm | |
| distance Between Board to Board | 1.6mm – 2mm | |
| Stamp Hole Size | 0.60mm, 0.8mm,1.0mm | |
| Stamp Holes Width | 5mm | |
| Panel of Round PCBs | Single PCB size is more than 20mmx20mm | |
| Rails of Panel | More than 3mm | 2 rails or 4 rails |
Surface treatments
| Specifications | Standard Technology | Notes |
| PCB Surface Finishes | HASL (Solder) | 1-40μm |
| Lead Free Solder | 1-40μm | |
| OSP | ||
| Immersion Tin | ||
| ENIG (electroless nickel immersion gold) | NI 100-200uin (μ”), Au 1-3uin (μ”) | |
| Gold Plating | NI 120-200u”, AU 1-100 u” | |
| Gold Fingers | 3-100u” Au | |
| ENEPIG | NI 200u” , Pd 1-10u” , Au 1-10u” |
Additional Capabilities
| Additional Features | Plated Slots | |
| Plated Edges | ||
| Counter Sinks | ||
| Covered Vias | ||
| Counter Sinks | ||
| Non-Conductive Filled Vias (Resin Filled Vias) | ||
| Silver Filled Vias | ||
| Controlled Impedance | 50 Ω: Single-ended traces, 90 Ω or 100 Ω: Differential pairs | |
| Carbon Inks | 0.4-2mil |
Features & Benefits
With the development of the technology and electronics industry, the PCB industry is also advancing toward high precision and cutting-edge innovation. MultPCB has consistently focused on industry trends and dynamics, continuously improving itself to meet the needs of the industry and its customers.
High technology enables future electronic products to become increasingly powerful in functionality, and correspondingly, PCB circuits will also become more precise.
Higher requirements of electronics products will make the PCB circuits more and more complex in future, more layer and with higher circuits density will be the trend.
As AI and Robots technology are rapidly developing in recent years, the rigid PCBs and Flex PCBs are demanded to be more flexible.
Environment sustainable development is always people's key care as long as we are live in this Earth, Protect environment is to pretect ourselves.